DT-250-PH & DT-260 PH Un-Slide (Reflow Soldering)

The Desktop DT-250-PH and DT-260-PH Uni-Slide series are part of a line of (semi-) automatic systems developed for Hot bar Soldering. The "PH" stands for the pulsed heat Hot bar. The model "250" has a manually operated 2-position slide, whereas the model "260" has a 3-position slide.

The Desktop Series deliver the same high bonding quality as the larger and more automated systems. It offers an ideal price-performance (throughput) ratio. The slide enables easy loading and unloading of the parts directly in front of the operator. If the parts require alignment, this can be done in the front (loading) position where the operator has sufficient free space for loading and alignment of the parts, the camera position offers a view that isn't blocked by the bonding head. The manually operated slide locks into position and is sensor dete

Options:

Kapton Interposer Module

With some solder Hot bar reflow applications the Hot bar (thermode) is in direct contact with the flux and/or solder material. This causes pollution of the Hot bar and requires regular cleaning. The kapton Interposer Module offers a solution for this. This Module consists of two reels (spools). One spool holds a full reel of kapton, the other one winds the used kapton. The Kapton interposer Module can be installed on each desktop system.

Alignment Module

If your parts require accurate (fine-pitch) alignment, we recommend to use an Optical Alignment Module. This includes a CCD camera with a special lens, special illumination, 7" TFT screen and power supplies. The optical system magnifies and displays the track on the TFT screen. Operator speed and operator accuracy will surely increase.

Product Jig Module

The heart of the Desktop ACF Laminating system is the ACF module. This module positions the ACF tape accurately above the pre-loaded parts in the tooling. Prior to laminating / pre-Bonding the ACF to the substrate, the ACF tape is pre-cut at the required length of ACF from a reel of ACF. Cutting is done using the half-cut method which cuts the actual ACF material. The cover-layer is used for tape transport. The ACF is now positioned over the bond surface. By placing the Hot bar on the ACF material the laminating / pre-Bonding is achieved. After the

Flux Dispensing Module

AMADA MIYACHI EUROPE offers a customized Flux Dispensing Module. Applying flux for Reflow solder products can be done through this (optional) Flux dispense module. The flux Dispensing Module includes a linear or X-Y movement to position the dispense valve over the bonding pads. Dispensing position and the amount of flux material are easily adjustable.