The AMADA MIYACHI Hot bar product line uses a range of standard modules and offers a reliable, versatile and consistent system configuration for a variety of applications. Using standard modules in the entire value chain from application development to high volume production delivers predictable, consistent and premium quality for your bonding application(s).

AMADA MIYACHI offers a full range of bonding heads available for the Hot bar product line. The bonding heads can be used for Hot bar reflow soldering, ACF-Laminating, Heat seal bonding and Heat staking.The bonding heads offer maximum productivity and consistent process control. The designs are modular, compact, rigid and easily adjustable.

This modular approach enables you to upgrade or reconfigure your system whenever needed. The compact unit minimises floor space requirements. The robust bonding heads offer the highest connection accuracy for fine-pitch applications and long thermode lengths at the highest bonding forces.

To achieve optimum force accuracy and consistency the bonding heads are available in a pneumatic and motorised model and offer a complete bond force range from 8 to 2500N.

Download the Bonding Heads Technical data sheet for more information and options.