Wafer Marking System

Small footprint.

Features

This system is for marking on wafers; silicon wafer, sapphire substrate, and compound wafer.

* Small footprint.

* Highly precise marking.

* High throughput.

[White marking: by SHG laser[ It melts only surface of a silicon wafer, so marking can be done without particles.

[Black marking: by fundamental laser] It engraves surface of a silicon wafer. Marked workpiece has a high level of visibility and can be read clearly even after cleansing and grinding.